As the name suggests, burn-in testing is a more intense type of testing for PCBs. Its designed to detect early failures and establish load capacity. Because of its intensity, burn-in testing can be destructive to the parts being tested.
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This is done by running a power supply through the electronics at an elevated temperature, often its maximum-specified capacity.
Electronics have a higher failure rate at the beginning of their life cycle, leveling out in the middle and rising again as they reach the end of the life cycle. If a PCB with an infant mortality failure like this were to make its way into military or medical equipment, it could result in a potentially serious failure.
Burn-in testing reduces the number of latent defects by triggering them through this testing, resulting in a more reliable batch of electronics for the OEM, the trade-off being a smaller yield and potentially reduced product lifespan.
The data collected through this process can in turn help engineers understand what caused the defects and modify the design to improve product reliability before it even hits burn-in.
Bram Stokerthe author of the classic novel Draculanoted that We learn from failure, not from success. Perhaps he was right. Success is never a sure guarantee in life. Experiencing failure is an inevitability at one time or another. Many people do anything to avoid this sense of negativity and worthlessness, even ceasing to attempt anything new.
Modern innovators and engineers, however, are not these kinds of people.
Even though not everything they create is perfect, these designers know endeavor is still worthwhile. Discovering a genuine solution is one of the greatest thrills of all time, especially for the creators of electronic products. These products need to be tried and tested numerous times before nailing objectives and performance demands on the head. The PCB testing method is an integral part of the modern manufacturing process for this very reason: eliminating the cost of failure.
But how do PCB assemblers test for a flawless design? Weve compiled a list of the main seven types of PCB testing methods used throughout stages of the assembling process. Heres what you need to know about inspection and testing in the PCB industry today.
When considering the seven types of PCB testing methods and what you need to know about them, keep function and form in mind. A failed PCB function is problematic for companies that use it in their products. Electronics that malfunction after they hit the market are harmful to businesses reputations and consumers alike. Without proper and thorough testing beforehand, significant risks linger. Testing and inspection is a strategy to ensure PCBs efficiently meet current standards.
PCB testing during manufacturing builds up a pillar of confidence in circuit board design and capability. Manufacturers can choose a wide array of common methods to use. The application and board type of your PCB are the core factors that impact the decision. Lets explore and compare these different testing methods and specializations further.
Visual inspection is a general method of testing thats relatively cost-effective and easy to set up. This basic process involves a technician visually inspecting the board for noticeable defects. These defects typically include soldering mistakes, irregular component orientation, circuit board stains, or missing parts.
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While most of these major defects are identifiable via bare eye inspection of magnification, the process is subject to human error. Depending on the complexity of the board, this method can have possible inconsistencies which are time-consuming to fix.
This popular testing method is preferable for the majority of PCB manufacturersdue to its robust ability to find over 90 percent of faults, that is. As a form of automated testing, youll find this method most employed on larger batches or mature productsnot prototypes or low-volume productions. During this process, technicians use specialized equipment, including an in-circuit tester system of sensors, a fixture of sensor points, and software that dictates pass or fail parameters.
Manufacturers can test individual components with this method to measure their specific performance. ICT is best for measuring resistance, capacitance, and analog measures to finalize stable products.
Flying probe testing is an enhanced form of ICT that uses needles to read board components. This popular method uses an innovative flying probe machine and programming to identify design efficiencyand its generally more cost-effective for the test coverage. FPT checks overs PCBs for shorts, transistor orientation, diode issues, resistance, capacitance, and inductance. Keep in mind that flying probe testing doesnt power up a PCB like other common methods.
Another automation method is known as AOI. This process involves 2D or 3D cameras taking high-resolution images of the PCB to compare with a template board. Basically, AOI inspects the PCB and determine how accurately it matches the original design schematics. This type of machine might be directly at the end of the mass production line for quality assurance. If something doesnt add up, the board gets flagged and sent back for technician review.
What makes AXI testing technology unique from other common optical methods is the use of X-rays. This inspection method can directly penetrate the PCB and component bodies to examine the quality of solder joints. Hence, this valuable tool is ideal for PCBs with hidden joints, chip components, or underside pads.
When manufacturers use this technology during the production process, they can detect defects early on and make the necessary adjustments to save costly repairs. X-ray inspection is time-consuming but remains a smart option for varied-size production batches or complex prototypes.
Burn-in testing is a method revolving around early failure detection during manufacturing. Unlike other common inspection processes, this testing directly simulates extreme operating conditions and subjects PCBs to them to test load capacity. Collected data helps engineers understand defect causes and optimize the design to eliminate premature failures in the field. Manufacturers can test the operating conditions of printed circuit boardstemperature, voltage, or frequencyby sending a high-powered current through the circuit.
The process is intense and not necessary for every type of electronic product. Burn-in testing is best for those designing products that require top-notch reliability. A word of cautionthis method can shorten the products lifespan if tested for too long.
Traditional functional testing is a flexible method thats typically the last phase of the production process. As a quality control procedure, FCT ensures the device under testing operates exactly as its intended to. Essentially, manufacturers verify the product will effectively power up in its end-use environment.
The exact requirement of this testing depends on the complexity of the PCB design Overall, FCT is ideal for detecting functional and parametric failures and pairs well with other PCB assembly testing types. No matter the production batch size, product quality assurance can be yours.
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Advanced Assembly is here to take the hassle and headaches out of the PCB assembly process by building your project right the first time. Contact us with any questions about our capabilities and testing methods or start a quote today. Lets get your boards produced with speed, accuracy, and quality in mind.
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