Challenges of 5G PCB Technology

Two significant challenges for 5G PCB designs deal with the antenna box and thermal management materials:

• Antenna box: 5G technology utilizes extremely high frequency (EHF), which requires more base stations and array antennas to operate effectively. PCB manufacturers will need to create a larger active antenna box to house these multiple antenna array units (AAU).
• Thermal management: Because 5G outputs more power and speed with reduced latency, manufacturers need to analyze existing materials and make design changes that promote better thermal management. This includes heat dissipating structures and materials with low dielectric constants to eliminate lost signals and prevent PCB breakdown.

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